Shenzhen SMT & RF Engineering Center
OEM & ODM Engineering Services
End-to-end hardware development for industrial IoT: from high-speed multi-layer PCB routing and custom RF antenna simulation to high-throughput cleanroom SMT mass manufacturing and locked-down firmware provisioning.
±0.015mm
SMT Precision (Cpk ≥ 1.66)
1.2M/mo
Monthly PCBA Capacity
< 15days
Rapid EVT / DVT Cycle
Shenzhen Cleanroom Facility
Yamaha YSM20R High-Speed Modular SMT Lines
Nitrogen reflow & real-time 3D solder paste inspection
Pre-Certified Global Compliance & Standards
ISO 9001:2015
QMS Certified
CE RED
2014/53/EU Direct
FCC Part 15B
Cellular & Radiator
PTCRB & GCF
Carrier Certified
RoHS & REACH
Lead-Free SMT
UN38.3
Lithium Air Cargo
Customization Architecture
4-Tier Modular Engineering
Granular support tailored to your project milestones, spanning white-label configuration through ground-up silicon, mechanical tooling, and global filings.
01
Hardware & PCB
Multi-layer HDI layout, proprietary form-factor miniaturization, CAN-bus integration, and low-noise sensor arrays.
4-10 Layer FR4 / Rogers RF
BLE 5.3 • LTE Cat-1 / Cat-M
RS485, Modbus, 1-Wire, I2C
02
Firmware & Protocol
Production flashing with bespoke TLS root certificates, GT06/JT808 telematics emulation, and carrier APN locks.
Corporate MQTT / AWS IoT
Bespoke FOTA Bootloader
Zephyr RTOS & Embedded C
03
Mechanical & Tooling
CNC housing prototypes, hardened steel molds for injection, IP67/IP68 ultrasonic welding, and UV laser etching.
IP67 / IP68 Ingress Enclosure
UV Laser Logo / IMEI Matrix
UL94-V0 Fire-Retardant Resin
04
Certification & Testing
Direct FCC / CE ID transfers, UN38.3 battery drop tests, turnkey retail packaging, and export compliance handling.
FCC / CE Certification Transfer
UN38.3 Drop-Tested Cartons
White-Label Giftbox & Inserts
Zero-Defect Standard
The 4-Gate Hardware Quality Control Matrix
Every commercial manufacturing batch passes through automated optical, structural, thermal, and RF chamber verification before logistics sign-off.
Gate 01 • SMT Placement
Yamaha High-Speed SMT
Handles micro-passives down to 0201 packages with 10-zone nitrogen reflow preventing micro-BGA solder oxidation.
Placement Pitch: ±0.015mm • 45,000 CPH
Gate 02 • Optical & X-Ray
3D AOI & Solder SPI
Multi-angle optical inspection coupled with SPI checks fillet coplanarity, bridge detection, and voids below 8%.
X-Ray Resolution: 2.0 μm • 100% Inline
Gate 03 • Environmental Stress
Thermal Soak & Burn-In
48-hour continuous cycling from -40°C to +85°C at 90% humidity to eliminate early infant mortality of silicon components.
Range: -40°C ~ +85°C • 48h Stress Run
Gate 04 • RF Wireless Validation
Anechoic Chamber (OTA)
Over-The-Air TRP and TIS measurements ensure optimal radiated efficiency for LTE-M, NB-IoT, GNSS, and BLE antennas.
Bandwidth: 600MHz - 6GHz • Full OTA
Confidential Review
Initiate an OEM/ODM Feasibility Review
Submit your preliminary requirements. Our senior hardware engineering team provides an initial DFM assessment and Open-BOM guidance within 24 hours.